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BGA |
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BGA Rework Station : Model No WT-5860
- With the liner slide, all the X、Y、Z axis can do precision adjustment and fast positioning.
- HD touch screen, PLC control, can save multiple sets of temperature profile data; with instant temperature curve analysis function.
- 3 independent heating areas from top to bottom. The 1st and 2nd are hot air heaters, the 3rd is IR preheating, temperature controlled within ±3°C
- Offer all kinds of hot air nozzles which can rotate 360° with magnet, easy to install and change.
- Use a V-groove equipped with a flexible fixture for PCB positioning to protect the PCB from deformation when heated or cooled; it can rework any BGA package size.
- Powerful cross-flow fan rapidly cool the PCB to improve efficiency; Also built-in vacuum pump and external vacuum suction pen, pick up the Chips rapidly.
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Technical Data |
| Total Power |
4800W |
| Top Heater Power |
800W |
| Bottom Heater Power |
2nd heater: 1200W, 3rd IR heater: 2700W |
| Dimensions |
635 x 600 x 560mm |
| Positioning |
V-groove, with external universal fixture |
| Temperature Control |
Temperature Control |
| PCB Size |
Max: 410 x 370mm Min: 20 x 20 mm |
| Net Weight |
40 Kg |
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BGA Rework Station : Model No. WT-6200
- 3 Independent Heating System You can use software to choose to use top heater or bottom heater separately or combine the top and bottom heater’s capacity, so as to make it easier to rework double GA, CCGA, QFN, CSP, LGA, SMD, etc.
- Precise Optical Alignment System Clear images with a 12” HD monitor, components can be enlarged up to maximum 230 times, mounting accuracy within ± 0.01mm, with a beam split, zoom in, zoom out and fine-tuning functions.
- Multi-function Operation System With touch screen interface, k-type thermocouple and intelligent temperature compensation, integrated design of top heater and sucker point; it can auto identify a high degree of suction and mounting; with automatic soldering and Desoldering functions; temperature can be set to 6 segments and 6 segments constant temperature control, can save N groups of temperature setting parameters for different kinds of BGA chip sets.
- Superior Safety Functions After finish Desoldering and soldering, there is an alarming; when temperature goes out of control, the circuit will automatically power off. It is of double excess temperature protection function. A password is needed for temperature parameter to avoid random changes.
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Technical Data |
| Total Power |
4800W Max |
| Top Heater Power |
800W (1st heater) |
| Bottom Heater Power |
1200W (2nd heater) |
| 3rd IR Heater |
2700W |
| Dimensions |
640 x 630 x 900mm |
| Temperature Control |
K-type thermocouple (Closed Loop control) |
| Positioning |
V type groove, with universal fixture |
| PCB Size |
Max: 410 x 370mm Min: 65 x 65mm |
| Available BGA Chip |
1 x 1mm ~ 80 x 80mm |
| External Temperature Sensor |
1 piece |
| Net Weight |
65 Kg |
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Propack Products & Services |
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